Silicon Epi Technology

GlobiTech produces a wide variety of silicon epi products.

  • Diameter – 150mm, 200mm
  • Epi Thickness – 0.1um to 150um
  • Epi Resistivity – 0.01 to 1000 Ohm-cm
  • Layer Thickness/Resistivity Uniformities – Typical:<2% / 4%
  • Surface Defects – <20 @ 0.2um LSE
  • Dopant Source – Boron, Phosphorus, or Arsenic

GlobiTech has access to a broad range of substrate types from multiple silicon wafer suppliers.

  • 150mm, and 200mm wafers.
  • Heavily Doped Arsenic
  • Red Phosphorus
  • Antimony
  • Boron

Processes Available:

Single Wafer Epi Deposition

  • 150mm, & 200mm Wafers
  • Atmospheric Pressure
  • TCS Source Gas
  • Improved Auto-Doping Control Process (Improved Breakdown Voltage Uniformity).
  • Dual Layer / Ramped Layer

Wafer Polishing

Wafer Cleaning

Oxide Strip