Concurrent inspection of various surface defects and Epi layer BPD/SF
High accuracy Automatic Defect Classification (ADC) by virtue of ultra-high-resolution review images
High throughput (10 WPH with 6-inch wafer)
Incoming and outgoing inspection of bare SiC wafers and SiC Epi wafers
Monitoring of SiC polishing and epitaxial growth processes
Management of SiC device manufacturing processes
KLA-Tencor SP1/6220
Surfscan is used for particle wafer defect inspection and review systems to find, identify and classify particles and pattern defects on the front surface, a back surface, and the edge of the wafer
Dual-laser illumination with simultaneous darkfield and brightfield modes enables detection of a wide range of yield-limiting defects at a high capture rate in a single pass
Real-time defect classification (RTDC) enables the filtering of nuisance defects and noise and accelerates root-cause analysis
Simultaneous collection of haze information provides detailed information on wafer surface quality
Additional Systems
FabGuard FDC provides run-by-run and real-time analysis for process control and fault finding for seamless integration of equipment and sensor data allowing data from multiple sources to be available for analysis
GlobiTech uses ADE Ultrascan technology to analyze and report wafer dimensional quality including flatness and warp as well as substrate resistivity and electrical typing
ICP-MS analysis to detect a wide array of bulk metals on the order of parts-per-trillion
Auto-Titration – clean line bath monitoring
Optical microscope with Nomarski DIC allows seeing features down to several angstroms in height used for slip and misfit inspection
